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RC / RC2 / RZ Series

AirBorn MicroQuad  is designed to handle high-speed LVDS

AirBorn MicroSI is suitable for differential serial buses.


Stackable, Press-Fit, Compliant Pin/Socket 

A high-density press-fit mounted connector using patented stacking contacts consisting of a female/compliant/male configuration used in board to board stacking applications. Aligned field connector contact configurations for improved signal integrity are also available.

Features and Benefits

•      This is a COTS connector, with less than 4 weeks lead time

•      RCII is optimised for signal routing both Single ended & Differential 

•      Board to board offering + cable to board & Flex to Board both high speed & power

•      Reliable “eye of the needle” compliant section design eliminates soldering

•      BeCu contacts (special high conductivity, high temperature alloy)

•      Contacts with different tail lengths can be selectively loaded in any pattern per customer requirement

•      Long “wipe”, high “normal force”, redundant “cross cylinder” contact interface design provides very reliable

       electrical connection


Contact                                        BeCu per ASTM-B768 (BeCu C17410 Brush Ally 174)

Contact Finish                            Gold per MIL-G-45204 over Nickel per IAW QQ-N-290

Moulded Insulator                    Glass illed polyphenylene sulphide (PPS) per MIL-M-24519

Hardware                                    Stainless steel per ASTM A 582, Passivated per ASTM-957

Guide Pin/Socket                       BeCu per ASTM-B 196/197, Nickel plated per QQ-N-290



Current Rating                           3.0 Amperes 

Operating Temperature           -65°C to +125°C

Insulation Resistance               5,000 megaohms minimum @ 500 VDC 

Durability                                   500 connector mating cycles 

Contact Resistance                  3 to 5 milliohms (contact length dependent)

Contact Engagement Force    4.0 oz. (113g) max. w/.0246” dia. test pin

Contact Separation Force       0.5 oz. (14g.) min. w/.0226” dia. test pin 

Compliant Insertion Force      22.5 ib. (10.21 Kg.) max. per contact 

Compliant Removal Force      4.5 ib. (2.04 Kg.) min. per contact


0.05” 1.27mm Vertical Compression (Z-Axis) LGA Connector


A high density LGA (solderless) open-field, vertically-compressed connector utilising a patented z-axis contact system configured for between-boards compression applications. 



Contact                                       BeCu C17200 per ASTM B194 (brush alloy)

Contact Finish                           Gold per ASTM B488 over nickel per SAE AMS-QQ-N-290

Moulded Insulator                   Glass-filled polyphenylene sulphide (PPS) per MIL-M-24519

Hardware                                   Stainless steel per ASTM A582/582M

                                                     Passivated per SAE AMS-2700



Contact Compression             0.01”/side (nominal for 0.100” and 0.150”conector heights

                                                    -0.015”/side (nominal) for 0.0200”, 0.250”, 0.300” and 0.350” connector heights 

Compression Force                At a nom. of 0.01, compression force is 30 to 40 grams 

                                                   At a nom. of 0.015, compression force is 40 to 50 grams 

Contact Co-Planarity              0.006 max

Contact Wipe                           0.007” for 0.100” and 0.150” connector heights 

                                                   0.015”for 0.200”, 0.250”, 0.300” and 0.350” connector heights 

Current Rating                         0.5 amperes 

Contact Resistance                 25 milliohms typical (contact height dependent) 

Operating Temperature         -65°C to +125°C

Insulation Resistance             5,000 megaohms minimum @ 100 VDC

Dielectric Withstanding         250 VDC @ sea level, 100 VDC @ 70,000 ft. 

Durability                                 Min.50 mating cycles – currently testing for 1000 cycles

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