RC / RC2 / RZ Series
AirBorn MicroQuad is designed to handle high-speed LVDS
AirBorn MicroSI is suitable for differential serial buses.
RC/RC2
Stackable, Press-Fit, Compliant Pin/Socket
A high-density press-fit mounted connector using patented stacking contacts consisting of a female/compliant/male configuration used in board to board stacking applications. Aligned field connector contact configurations for improved signal integrity are also available.
Features and Benefits
• This is a COTS connector, with less than 4 weeks lead time
• RCII is optimised for signal routing both Single ended & Differential
• Board to board offering + cable to board & Flex to Board both high speed & power
• Reliable “eye of the needle” compliant section design eliminates soldering
• BeCu contacts (special high conductivity, high temperature alloy)
• Contacts with different tail lengths can be selectively loaded in any pattern per customer requirement
• Long “wipe”, high “normal force”, redundant “cross cylinder” contact interface design provides very reliable
electrical connection
Materials
Contact BeCu per ASTM-B768 (BeCu C17410 Brush Ally 174)
Contact Finish Gold per MIL-G-45204 over Nickel per IAW QQ-N-290
Moulded Insulator Glass illed polyphenylene sulphide (PPS) per MIL-M-24519
Hardware Stainless steel per ASTM A 582, Passivated per ASTM-957
Guide Pin/Socket BeCu per ASTM-B 196/197, Nickel plated per QQ-N-290
Performance
Current Rating 3.0 Amperes
Operating Temperature -65°C to +125°C
Insulation Resistance 5,000 megaohms minimum @ 500 VDC
Durability 500 connector mating cycles
Contact Resistance 3 to 5 milliohms (contact length dependent)
Contact Engagement Force 4.0 oz. (113g) max. w/.0246” dia. test pin
Contact Separation Force 0.5 oz. (14g.) min. w/.0226” dia. test pin
Compliant Insertion Force 22.5 ib. (10.21 Kg.) max. per contact
Compliant Removal Force 4.5 ib. (2.04 Kg.) min. per contact
RZ
0.05” 1.27mm Vertical Compression (Z-Axis) LGA Connector
A high density LGA (solderless) open-field, vertically-compressed connector utilising a patented z-axis contact system configured for between-boards compression applications.
Materials
Contact BeCu C17200 per ASTM B194 (brush alloy)
Contact Finish Gold per ASTM B488 over nickel per SAE AMS-QQ-N-290
Moulded Insulator Glass-filled polyphenylene sulphide (PPS) per MIL-M-24519
Hardware Stainless steel per ASTM A582/582M
Passivated per SAE AMS-2700
Performance
Contact Compression 0.01”/side (nominal for 0.100” and 0.150”conector heights
-0.015”/side (nominal) for 0.0200”, 0.250”, 0.300” and 0.350” connector heights
Compression Force At a nom. of 0.01, compression force is 30 to 40 grams
At a nom. of 0.015, compression force is 40 to 50 grams
Contact Co-Planarity 0.006 max
Contact Wipe 0.007” for 0.100” and 0.150” connector heights
0.015”for 0.200”, 0.250”, 0.300” and 0.350” connector heights
Current Rating 0.5 amperes
Contact Resistance 25 milliohms typical (contact height dependent)
Operating Temperature -65°C to +125°C
Insulation Resistance 5,000 megaohms minimum @ 100 VDC
Dielectric Withstanding 250 VDC @ sea level, 100 VDC @ 70,000 ft.
Durability Min.50 mating cycles – currently testing for 1000 cycles